TI’s TMP006

Today I received a sample order from Texas Instruments. Among several ICs for a school project I also sampled some of the TMP006  “Infrared Thermopile Sensors”. I don’t have a PCB to solder them to yet, so I decided to take some macro photos.

I apologize for the quality. The top light in my microscope burned out and so all the pictures are light from the side with a handheld flashlight while trying to hold my camera steady and focused through the eyepiece. After this buying a nice microscope with a built in digital camera seems like a good idea.

The title picture is the top of the chip. It has the part number (TMP006), the alignment mark in the lower left, and what is probably the lot trace code. The interesting part is when the chip is flipped over. This is a chip-scale BGA package, which is convenient in terms of the amount of space it takes up, but almost impossible to solder by hand. To give a sense of scale the spacing between the center of each metal ball is 0.5mm.

I would have liked to get some higher quality pictures, but that will have to wait until I have a better setup .